Design Guides

Assembly
... ...... Analysis of Factors that Affect Yield in SMT Assembly (GenRad, Inc.)

Buried Capacitance
.... ..... Buried Capacitance Design Guide (Hadco)

Cross Talk
.... ..... Currently under construction

Finishes
..... .... Hot Air Solder Leveling (Teledyne Electronic Technologies)
.......... Hot Air Solder Leveling Alternatives (Merix)
.......... Organic Solderability Preservatives (Merix)

High Speed
.........Currently under construction

Impedance
..... .... Currently under construction

Test
......... Boundary Scan and In-Circuit Test (GenRad, Inc.)
.......... Functional Test (GenRad, Inc.)
.......... RF Test (GenRad, Inc.)