PCB Design RFQ
All pricing is budgetary until final data is received.
Customer Information:
Company:
Contact:
Phone:
Fax:
E-mail:
General Design Information:
Raw Board Number:
Board Assembly Number:
Schematic Number:
Customer Spec Number:
Design Type:
Prototype
Pilot
Engineering Test
Production Release
ECO
Redesign
PCB Technology:
RF
Digital
Analog
Mixed
High-speed
Microwave
Laminate Material:
Arlon 350
Nelco N4000-13
Rogers Ultralam
Arlon 450
Rogers RO3003
RT/Duroid
FR4
Rogers RO4003
Taconic RF-35
FR4 Hi-temp
Rogers RO4350
Taconic TLX-8
Other:
Proposed Layer Count:
2
4
6
8
10
12
14
16
Other
Proposed Layer Stack:
Enter Layer stack, S=Signal, G=Ground, P=Power.
Example; 4-layer S/G/P/S or 10-layer S/S/G/S/S/P/S/S:
PCB Thickness:
0.031
0.062
0.093
Surface Finish:
HASL
Fused Tin/Lead
Un-fused Tin/Lead
White Tin
Tin Nickel
OSP
SMOBC/HASL
Immersion Gold
Solder Reflow
Other:
Soldermask Information:
Green
Primary Side
Red
Secondary Side
None
Both Sides
Silkscreen Information:
White
Primary Side
Black
Secondary Side
None
Both Sides
Tolerances and Minimums:
Registration:
Minimum Hole Size:
Minimum PWR Line Width:
Minimum PWR Space:
Mininun Line Width:
Minimum Line Space:
PCB Test Requirements (check all that apply):
None
Microsection
Ionic Contamination
Continuity Test
HI-POT
Controlled Impedance
IPC-D-356 Netlist Test
S.I.R.
Solder Sample
Other:
PCA Test Requirements (check all that apply):
In-circuit Test
Functional Test
None
Other:
Special Requirements:
Please enter and specific constraints such as, environmental, mechanical, heat sinking, via-in-pads, etc.
Please provide any sketches or drawings if available.